On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS

Riccardo Casati; Maurizio Vedani; Syed A. M. Tofail; Calum Dikinson; Ausonio Tuissi

doi:10.3221/IGF-ESIS.23.01

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Published Dec 28, 2012

DOI https://doi.org/10.3221/IGF-ESIS.23.01

Riccardo Casati

Department of Mechanical Engineering, Politecnico di Milano, Via La Masa 34, Milano, Italy

Maurizio Vedani

Department of Mechanical Engineering, Politecnico di Milano, Via La Masa 34, Milano, Italy

Syed A. M. Tofail

Materials and Surface Science Institute, University of Limerick, Limerick, Ireland

Calum Dikinson

Materials and Surface Science Institute, University of Limerick, Limerick, Ireland

Ausonio Tuissi

National Research Council (CNR-IENI), Corso Promessi Sposi 29, Lecco, Italy

Abstract

Shape memory alloy (SMA) wires are employed as actuators in small devices for consumer
electronics, valves and automotive applications. Because of the continued miniaturization of all the industrial
products, nowadays the tendency is to produce MEMS (micro electromechanical systems). Among the most
promising functional MEMS materials, the thin SMA wires that are offering a rapid actuating response with
high power/weigh ratio of the material, are attracting a world wide interest. This paper is aimed at showing the
production process and the characterizations of thin NiTi shape memory wires. The activity was focused on
drawing procedure and on functional and TEM characterizations of the final products. In particular, it was
evaluated the performance of the SMA wires for actuators in terms of functional fatigue and thermo-mechanical
properties by means of an experimental apparatus design ad hoc for these specific tests

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Issue

Vol. 7 No. 23 (2013): January 2013

Section

Miscellanea

How to Cite

Casati, R., Vedani, M., Tofail, S. A. M., Dikinson, C., & Tuissi, A. (2012). On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS. Frattura Ed Integrità Strutturale, 7(23), Pages 7–12. https://doi.org/10.3221/IGF-ESIS.23.01

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