Three-dimensional Numerical Analysis of a Joint Bonded Reinforced with Silica Nanoparticles (SiO2)

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Published Jan 30, 2020
DOI https://doi.org/10.3221/IGF-ESIS.52.11

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Noureddine Djebbar
University of HassibaBenbouali, Essalem city, Department of Mechanical Engineering N° 19 national road, Chlef 02000, Algeria.
https://orcid.org/0000-0002-6496-7996 Rachid Hadj Boulenouar
University of Sidi bel abbès, LMPM, Department of Mechanical Engineering, University of SidiBel Abbes, BP 89, Ben M’hidi city, SidiBel Abbes 22000, Algeria
https://orcid.org/0000-0003-1935-3562 Benali Boutabout
University of Sidi bel abbès, LMPM, Department of Mechanical Engineering, University of SidiBel Abbes, BP 89, Ben M’hidi city, SidiBel Abbes 22000, Algeria

Abstract

Nanostructured adhesives may be defined as those materials whose elements imbedded in an epoxy matrix have dimensions in the 1 to 100 nm range. One of the most interesting aspects of ceramic nanoparticles is that their mechanical properties depend strongly upon the particle size and shape. Silica nanoparticles (SiO2) have different physical and mechanical properties from bulk ceramics. The aim of the present study is to investigate the effect of the nanoparticles rate on the equivalent stress, peeling stress and shear stress as well as the strains developed in the adhesive joint. Three-dimensional finite element models of adhesive joint were developed to determine the stress intensity as well as strain with different nanoparticles rate in the epoxy resin. Dispersion of nanoparticles with different percent in the epoxy resin allows for reinforcing the adhesive. Polymer embedded silica nanoparticles (SiO2) proved to be highly effective.

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    Issue
    Vol. 14 No. 52 (2020): April 2020
    Section
    Advanced Manufacturing and Processing

    How to Cite

    Djebbar, N., Hadj Boulenouar, R., & Boutabout, B. (2020). Three-dimensional Numerical Analysis of a Joint Bonded Reinforced with Silica Nanoparticles (SiO2). Frattura Ed Integrità Strutturale, 14(52), 128–136. https://doi.org/10.3221/IGF-ESIS.52.11

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