K. Vogel D. Wuensch A. Shaporin J. Mehner D. Billep M. Wiemer


Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so-called low temperature bonding as a special direct bonding technology. It is carried out without intermediate layers and at temperatures below 400 °C. In addition to the wafer materials, the toughness of the bonded interface also depends on the bonding process itself. It can vary for different pre-treatments. Furthermore, an increase of the annealing temperature leads to a higher toughness of the bonded interface.
The fracture toughness is a suitable value to describe the damage behaviour of the bonded interface. Based on a micro-chevron-specimen, the fracture toughness can be determined either numerically or by combining numerical analysis with experimental measurement of the maximum force.
The maximum force is measured during a micro-chevron-test using a Mode I loading. The minimum of the stress intensity coefficient can be determined by a FE-simulation only. One possibility to estimate the stress intensity coefficient is the compliance method. The compliance of the whole specimen increases with a growing crack. The stress intensity coefficient can be directly derived from the simulated compliance and the crack length itself.
The paper is focused on the micro-chevron-test for direct bonded silicon-silicon wafers. Additional to the estimation of dimensionless stress intensity coefficient as a function of geometry, the influence of different pre-treatments and annealing temperatures on the measured maximum force are analysed and discussed.


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How to Cite

Vogel, K., Wuensch, D., Shaporin, A., Mehner, J., Billep, D. and Wiemer, M. (2013) “Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers”, Frattura ed Integrità Strutturale, 5(15), pp. pages 21–28. doi: 10.3221/IGF-ESIS.15.03.