S. de Miranda A. Palermo F. Ubertini


A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented.
The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elastic
foundation. An effective discrete model for inter-tile grouting is introduced with the aim of modelling
workmanship defects due to partial filled groutings. The model is validated using the results of a 2D FE model.
Different defect configurations and adhesive typologies are analysed, focusing the attention on the prediction of
normal stresses in the adhesive layer under the assumption of Mode I failure of the adhesive.



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